The laser sintering process of multi-component powder W/Cu is simulated by ANSYS software based on the factors of radiation, convection and thermal physical parameters on temperature. The laser power and scanning velocity which are the key process parameters to affect directly in sintering molding are studied in paper. The results show that when the scanning velocity is constant, the sintering depth is rising with the increase of laser power; In addition, when the laser power is constant, the sintering depth is decreasing with the increase of scanning velocity. To select reasonable processing parameters and meet the requirements of sintering quality on the sintering depth, the parameters of laser power and scanning velocity are optimized by analyzing the sintering depth.
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Key Laboratory of Ministry of Education for Conveyance and Equipment, East China Jiaotong University, Nanchang, 330013, China
Jian Zhang, Deying Li, Jianyun Li & Longzhi Zhao
EU-China Center for Information & Communication Technologies (CICTA), China Agricultural University, 17 Tsinghua East Road, 100083, Beijing, P.R. China
Daoliang Li & Yingyi Chen &
College of Mechanical and Electronic Engineering, East China Jiaotong University, Shuanggang Road, 330013, Nanchang, Jiangxi, China
Yande Liu
© 2011 IFIP International Federation for Information Processing
About this paper Cite this paperZhang, J., Li, D., Li, J., Zhao, L. (2011). Numerical Simulation of Temperature Field in Selective Laser Sintering. In: Li, D., Liu, Y., Chen, Y. (eds) Computer and Computing Technologies in Agriculture IV. CCTA 2010. IFIP Advances in Information and Communication Technology, vol 347. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-18369-0_56
Download citationDOI: https://doi.org/10.1007/978-3-642-18369-0_56
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-18368-3
Online ISBN: 978-3-642-18369-0
eBook Packages: Computer ScienceComputer Science (R0)
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