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Showing content from https://en.wikipedia.org/wiki/List_of_Intel_Core_microprocessors below:

List of Intel Core processors

From Wikipedia, the free encyclopedia

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The following is a list of Intel Core processors. This includes Intel's original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture, as well as its Core 2- (Solo/Duo/Quad/Extreme), Core i3-, Core i5-, Core i7-, Core i9-, Core M- (m3/m5/m7/m9), Core 3-, Core 5-, and Core 7- Core 9-, branded processors.

Desktop processors[edit] Front side of an Intel Core 2 Duo T7500 Processor

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)^a
Die size: 111 mm²
Steppings: L2^b, M0^c, G0^d

^c Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

^d Note: The E4700 uses G0 Stepping which makes it a Conroe CPU.

"Conroe" (65 nm, 1066 MT/s) [edit]

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)^a
All models support: Intel VT-x
Die size: 143 mm²
Steppings: B2, G0

^a Note: of the E6000 series processors, only models E6550, E6750, and E6850 support Intel's Trusted Execution Technology (TXT).^[1]

^b Note: The L2 Stepping, and models with sSpec SL9ZL, SL9ZF, SLA4U, SLA4T, have better optimizations to lower idle power consumption from 22W to 12W.^[2]

^c Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

"Conroe" (65 nm, 1333 MT/s)[edit]

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)^a
All models support: Intel VT-x
All E6x50 models support: Intel VT-x, Trusted Execution Technology (TXT)
Die size: 143 mm²
Transistor count: 291 million
Steppings: B2, G0

^a Note: of the E6000 series processors, only models E6550, E6750, and E6850 support Intel's Trusted Execution Technology (TXT).^[1]

^b Note: The L2 Stepping, and models with sSpec SL9ZL, SL9ZF, SLA4U, SLA4T, have better optimizations to lower idle power consumption from 22W to 12W.^[2]

^c Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

"Conroe-CL" (65 nm, 1066 MT/s)[edit]

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
Die size: 111 mm² (Conroe)
Steppings: ?

"Conroe XE" (65 nm)[edit]

^[3]^[4]

These models feature an unlocked clock multiplier

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
Die size: 143 mm²
Steppings: B1, B2
The X6900 was never publicly released.

"Kentsfield" (65 nm)[edit]

^[7]^[8]

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
Die size: 2 ×143 mm²
Steppings: B3, G0

"Kentsfield XE" (65 nm)[edit]

^[10]

These models feature an unlocked clock multiplier

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
Die size: 2 ×143 mm²
Steppings: B3, G0

"Wolfdale-3M" (45 nm, 1066 MT/s)[edit]

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
Die size: 82 mm²
Transistor Count: 230 million
Steppings: M0, R0
Models with a part number ending in "ML" instead of "M" support Intel VT-x

"Wolfdale" (45 nm, 1333 MT/s)[edit]

All models(except E8190) support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), iAMT2 (Intel Active Management Technology), Intel VT-x ^[a], Intel VT-d ^[b], Trusted Execution Technology (TXT)
Die size: 107 mm²
Transistor Count: 410 million
Steppings: C0, E0

^a Note: The E8190 and E8290 do not support Intel VT-d.

Note 2: E8700 is a very rare example in Intel's history where a model was yanked from Intel ARK without a recall notice and after a SSPEC was assigned. Working examples were seen, believed to have been released to OEM,^[12] but none was offered in retail PCs.

See also: Versions of the same Wolfdale core in an LGA 771 are available under the Dual-Core Xeon brand.

"Yorkfield-6M" (45 nm)[edit]

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x ^[a], Intel VT-d ^[b], Trusted Execution Technology (TXT) ^[c]
Die size: 2 × 82 mm²
Steppings: M0, M1, R0
All Q8xxx models are Yorkfield-6M MCMs with only 2 × 2 MB L2 cache enabled.

^a Note: Q8200, Q8200S, Q8300 SLB5W does not support Intel VT-x.

^b Note: Q8200, Q8200S, Q8300, Q8400, Q8400S, Q9500 does not support Intel VT-d.

^c Note: Q8200, Q8200S, Q8300, Q8400, Q8400S does not support TXT.

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Intel VT-d, Trusted Execution Technology (TXT)
Die size: 2 × 107 mm²
The "S" suffix denotes to low power consumption specs with 65W TDP, equivalent to that of a standard Core 2 Duo. Supplied to OEM channels only and mostly seen as options for SFF platforms. The first batch of Q9550S has no "S" marking on lid, thus only differentiated by SSPEC.
Steppings: C0, C1, E0

"Yorkfield XE" (45 nm)[edit]

These models feature an unlocked clock multiplier
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
I/O Acceleration Technology (Intel I/OAT) supported by: QX9775
Intel VT-d supported by: QX9650^[13]
Die size: 2 × 107 mm²
Steppings: C0, C1, E0
The QX9750 was never publicly released. Engineering samples have surfaced along with claims that Intel gave them away to employees sometime in 2009.^[14]^[15]^[16]

Common features:

Socket: LGA 1156.
All the CPUs support dual-channel DDR3 RAM at up to 1333 MT/s speed.
All CPU models provide 16 lanes of PCIe 2.0.
All CPUs feature a DMI 1.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 45 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.

Processor
branding Model Cores
(Threads) Clock rate (GHz) Smart
Cache TDP Release
date MSRP Base Turbo Core i7 880 4 (8) 3.06 3.73 8 MB 95 W May 2010 US $583 875K 2.93 3.60 US $342 870 September 2009 US $562 870S 2.67 82 W July 2010 US $351 860 2.80 3.46 95 W September 2009 US $284 860S 2.53 82 W January 2010 US $337 Core i5 760 4 (4) 2.80 3.33 95 W July 2010 US $205 750 2.66 3.20 September 2009 US $196 750S 2.40 82 W January 2010 US $259

Common features:

Socket: LGA 1366.
All the CPUs support triple-channel DDR3 RAM, at up to 1066 MT/s speed.
PCIe lanes are provided by the northbridge on the motherboard rather than by the CPU.
All CPUs feature a QPI bus to the chipset (northbridge).
- Bus speed is 4.8 GT/s on all the processors except for the Extreme Edition models, which run at 6.4 GT/s.
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 45 nm.
Extreme Edition processors have an unlocked multiplier and can be overclocked.

Intel i3 540 CPU die shot (Westmere) Intel i3 540 CPU and IGPU Dies

Common features:

Socket: LGA 1156.
All the CPUs support dual-channel DDR3 RAM, at up to 1333 MT/s speed.
All CPU models provide 16 lanes of PCIe 2.0.
All CPUs feature a DMI 1.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 32 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.

Processor
branding Model Cores
(Threads) Clock rate (GHz) Integrated GPU Smart
Cache TDP Release
date MSRP Base Turbo Model Clock (MHz) Core i5 680 2 (4) 3.60 3.86 HD Graphics 733 4 MB 73 W April 2010 US $294 670 3.46 3.73 January 2010 US $284 661 3.33 3.60 900 87 W US $196 660 733 73 W 655K 3.20 3.46 May 2010 US $216 650 January 2010 US $176 Core i3 560 3.33 — August 2010 US $138 550 3.20 May 2010 540 3.06 January 2010 US $133 530 2.93 US $113

Common features:

Socket: LGA 1366.
All the CPUs support triple-channel DDR3 RAM, at up to 1066 MT/s speed.
PCIe lanes are provided by the northbridge on the motherboard rather than by the CPU.
All CPUs feature a QPI bus to the chipset (northbridge).
- Bus speed is 4.8 GT/s on all the processors except for the X-suffix models, which run at 6.4 GT/s.
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 32 nm.
X-suffix processors have an unlocked multiplier and can be overclocked.

Common features:

Intel i5 2500 die shot

Socket: LGA 1155.
All the CPUs support dual-channel DDR3 RAM, at up to 1333 MT/s speed.
All CPU models provide 16 lanes of PCIe 2.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 32 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.
i3-2120, i5-2400, and i7-2600 are available as embedded processors.
The Core i3-2102, once upgraded via Intel Upgrade Service, operates at 3.6 GHz, has 3 MB L3 cache and is recognized as Core i3-2153.

Processor
branding Model Cores
(Threads) Clock rate (GHz) Integrated GPU Smart
Cache TDP Release
date MSRP Base Turbo Model Clock (MHz) Core i7 2700K 4 (8) 3.5 3.9 HD 3000 850–1350 8 MB 95 W October 2011 US $332 2600K 3.4 3.8 January 2011 US $317 2600 HD 2000 US $294 2600S 2.8 65 W US $306 Core i5 2550K 4 (4) 3.4 — 6 MB 95 W January 2012 US $225 2500K 3.3 3.7 HD 3000 850–1100 January 2011 US $216 2500 HD 2000 US $205 2500S 2.7 65 W US $216 2500T 2.3 3.3 650–1250 45 W 2450P 3.2 3.5 — 95 W January 2012 US $195 2400 3.1 3.4 HD 2000 850–1100 January 2011 US $184 2405S 2.5 3.3 HD 3000 65 W May 2011 US $205 2400S HD 2000 January 2011 US $195 2390T 2 (4) 2.7 3.5 650–1100 3 MB 35 W February 2011 2380P 4 (4) 3.1 3.4 — 6 MB 95 W January 2012 US $177 2320 3.0 3.3 HD 2000 850–1100 September 2011 2310 2.9 3.2 May 2011 2300 2.8 3.1 January 2011 Core i3 2130 2 (4) 3.4 — 850–1100 3 MB 65 W September 2011 US $138 2125 3.3 HD 3000 US $134 2120 HD 2000 February 2011 US $138 2120T 2.6 650–1100 35 W US $127 2105 3.1 HD 3000 850–1100 65 W May 2011 US $134 2102 HD 2000 Q2 2011 US $127 2100 February 2011 US $117 2100T 2.5 650–1100 35 W US $127

Common features:

Socket: LGA 1155.
All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed.
All CPU models provide 16 lanes of PCIe. i5 and up models support it at PCIe 3.0 speeds while i3 models support it at PCIe 2.0 speeds.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 22 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.
i3-3220, i5-3550S and i7-3770 are available as embedded processors.

Processor
branding Model Cores
(Threads) Clock rate (GHz) Integrated GPU Smart
Cache TDP Release
date MSRP Base Turbo Model Clock (MHz) Core i7 3770K 4 (8) 3.5 3.9 HD 4000 650–1150 8 MB 77 W April 2012 US $342 3770 3.4 US $305 3770S 3.1 65 W US $305 3770T 2.5 3.7 45 W US $294 Core i5 3570K 4 (4) 3.4 3.8 6 MB 77 W US $225 3570 HD 2500 June 2012 US $205 3570S 3.1 65 W 3570T 2.3 3.3 45 W April 2012 3550 3.3 3.7 77 W 3550S 3.0 65 W 3470 3.2 3.6 650–1100 77 W June 2012 US $184 3475S 2.9 HD 4000 65 W US $201 3470S HD 2500 US $184 3470T 2 (4) 3 MB 35 W 3450 4 (4) 3.1 3.5 6 MB 77 W April 2012 3450S 2.8 65 W 3350P 3.1 3.3 — 69 W September 2012 US $177 3340 HD 2500 650–1050 77 W September 2013 US $182 3340S 2.8 65 W 3330 3.0 3.2 77 W September 2012 3335S 2.7 HD 4000 65 W US $194 3330S HD 2500 US $177 Core i3 3250 2 (4) 3.5 — 3 MB 55 W June 2013 US $138 3250T 3.0 35 W 3245 3.4 HD 4000 55 W US $134 3240 HD 2500 September 2012 US $138 3240T 2.9 35 W 3225 3.3 HD 4000 55 W US $134 3220 HD 2500 US $117 3220T 2.8 35 W 3210 3.2 55 W January 2013

Common features:

Socket: LGA 2011.
All the CPUs support quad-channel DDR3-1600 RAM.
All CPU models provide 40 lanes of PCIe 2.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 32 nm.
K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Intel i3 4130, Haswell 22nm die shot

Common features:

Socket: LGA 1150.
All the CPUs support dual-channel DDR3 RAM at up to 1600 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 22 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.
The following models are available as embedded processors: i3- 4330, 4350T, 4360, i5- 4570S, 4590T, 4590S, i7- 4770S, 4790S.

Processor
branding Model Cores
(Threads) Clock rate (GHz) Integrated GPU Smart
Cache TDP Release
date MSRP Base Turbo Model Clock (MHz) Core i7 4790K 4 (8) 4.0 4.4 HD 4600 350–1250 8 MB 88 W June 2014 US $350 4790 3.6 4.0 350–1200 84 W May 2014 US $312 4790S 3.2 65 W 4790T 2.7 3.9 45 W US $303 4785T 2.2 3.2 35 W 4770K 3.5 3.9 350–1250 84 W June 2013 US $350 4771 350–1200 September 2013 US $320 4770 3.4 June 2013 US $312 4770S 3.1 65 W US $305 4770T 2.5 3.7 45 W US $303 4765T 2.0 3.0 35 W Core i5 4690K 4 (4) 3.5 3.9 6 MB 88 W June 2014 US $242 4690 84 W May 2014 US $213 4690S 3.2 65 W 4690T 2.5 3.5 45 W 4670K 3.4 3.8 84 W June 2013 US $242 4670 US $213 4670S 3.1 65 W 4670T 2.3 3.3 45 W 4590 3.3 3.7 350–1150 84 W May 2014 US $192 4590S 3.0 65 W 4590T 2.0 3.0 35 W 4570 3.2 3.6 84 W June 2013 4570S 2.9 65 W 4570T 2 (4) 200–1150 4 MB 35 W 4470 4 (4) 3.3 3.5 350–1100 6 MB 84 W May 2014 OEM 4460 3.2 3.4 US $182 4460S 2.9 65 W 4460T 1.9 2.7 35 W March 2014 4440 3.1 3.3 84 W September 2013 4440S 2.8 65 W 4430 3.0 3.2 84 W June 2013 4430S 2.7 65 W Core i3 4370 2 (4) 3.8 — 350–1150 4 MB 54 W July 2014 US $149 4370T 3.3 200–1150 35 W March 2015 US $138 4360 3.7 350–1150 54 W May 2014 US $149 4360T 3.2 200–1150 35 W July 2014 US $138 4350 3.6 350–1150 54 W May 2014 4350T 3.1 200–1150 35 W 4340 3.6 350–1150 54 W September 2013 US $149 4330 3.5 US $138 4330T 3.0 200–1150 35 W 4170 3.7 HD 4400 350–1150 3 MB 54 W March 2015 US $117 4170T 3.2 200–1150 35 W 4160 3.6 350–1150 54 W July 2014 4160T 3.1 200–1150 35 W 4150 3.5 350–1150 54 W May 2014 4150T 3.0 200–1150 35 W 4130 3.4 350–1150 54 W September 2013 US $122 4130T 2.9 200–1150 35 W

Common features:

Socket: BGA 1364 (soldered).
All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
In addition to the Smart Cache (L3 cache), Haswell-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
Fabrication process: 22 nm.

Common features:

Socket: LGA 2011.
All the CPUs support quad-channel DDR3-1866 RAM.
All CPU models provide 40 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 22 nm.
K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Common features:

Socket: LGA 1150 for C-suffix processors, BGA 1364 soldered for R-suffix.
All the CPUs support dual-channel DDR3 RAM. C-suffix processors support it at speeds up to 1600 MT/s, while R-suffix support it at 1866 MT/s.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
In addition to the Smart Cache (L3 cache), Broadwell-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
Fabrication process: 14 nm.

Common features:

Socket: LGA 2011-3.
All the CPUs support quad-channel DDR4-2133 RAM.
i7-5820K provides 28 lanes of PCIe 3.0; i7-5930K and 5960X provide 40 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 22 nm.
K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Common features:

Socket: LGA 1151.
All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.

Processor
branding Model Cores
(Threads) Clock rate (GHz) Integrated GPU Smart
Cache TDP Release
date MSRP Base Turbo Model Clock (MHz) Core i7 6700K 4 (8) 4.0 4.2 HD 530 350–1150 8 MB 91 W August 2015 US $339 6700 3.4 4.0 65 W September 2015 US $303 6700T 2.8 3.6 350–1100 35 W Core i5 6600K 4 (4) 3.5 3.9 350–1150 6 MB 91 W August 2015 US $243 6600 3.3 65 W September 2015 US $213 6600T 2.7 3.5 350–1100 35 W 6500 3.2 3.6 350–1050 65 W US $192 6500T 2.5 3.1 350–1100 35 W 6402P 2.8 3.4 HD 510 350–950 65 W December 2015 US $182 6400 2.7 3.3 HD 530 September 2015 6400T 2.2 2.8 35 W Core i3 6320 2 (4) 3.9 — 350–1150 4 MB 51 W US $148 6300 3.8 US $139 6300T 3.3 350–950 35 W US $138 6100 3.7 350–1050 3 MB 51 W US $117 6100T 3.2 350–950 35 W 6098P 3.6 HD 510 350–1050 54 W December 2015

Common features:

Socket: BGA 1440 (soldered).
All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
In addition to the Smart Cache (L3 cache), Skylake-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
Fabrication process: 14 nm.

Common features:

Socket: LGA 2011-3.
All the CPUs support quad-channel DDR4-2400 RAM.
i7-6800K provides 28 lanes of PCIe 3.0; all other models provide 40 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Common features:

Socket: LGA 1151.
All the CPUs support dual-channel DDR4-2400 or DDR3L-1600 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.

Processor
branding Model Cores
(Threads) Clock rate (GHz) Integrated GPU Smart
Cache TDP Release
date MSRP Base Turbo Model Clock (MHz) Core i7 7700K 4 (8) 4.2 4.5 HD 630 350–1150 8 MB 91 W January 2017 US $339 7700 3.6 4.2 65 W US $303 7700T 2.9 3.8 35 W Core i5 7600K 4 (4) 3.8 4.2 6 MB 91 W US $242 7600 3.5 4.1 65 W US $213 7600T 2.8 3.7 350–1100 35 W 7500 3.4 3.8 65 W US $192 7500T 2.7 3.3 35 W 7400 3.0 3.5 350–1000 65 W US $182 7400T 2.4 3.0 35 W Core i3 7350K 2 (4) 4.2 — 350–1150 4 MB 60 W US $168 7320 4.1 51 W US $157 7300 4.0 US $147 7300T 3.5 350–1100 35 W 7100 3.9 3 MB 51 W US $117 7100T 3.4 35 W

Common features:

Socket: LGA 2066.
All the CPUs support quad-channel DDR4-2400 RAM. Models i7-7820X and above support it up to 2666 MT/s speeds.
i7 models provide 28 lanes of PCIe 3.0; i9 models provide 44 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.

Processor
branding Model Cores
(Threads) Clock rate (GHz) Smart
Cache TDP Release
date MSRP Base Turbo
2.0 Turbo
3.0 Core i9 7980XE 18 (36) 2.6 4.2 4.4 24.75 MB 165 W September 2017 US $1999 7960X 16 (32) 2.8 22 MB US $1699 7940X 14 (28) 3.1 4.3 19.25 MB US $1399 7920X 12 (24) 2.9 16.5 MB 140 W August 2017 US $1199 7900X 10 (20) 3.3 4.5 13.75 MB June 2017 US $989 Core i7 7820X 8 (16) 3.6 11 MB US $599 7800X 6 (12) 3.5 4.0 — 8.25 MB US $389

Common features:

Socket: LGA 2066.
All the CPUs support dual-channel DDR4-2666 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
X-suffix processors have an unlocked multiplier and can be overclocked.

Common features:

Socket: LGA 1151-2.
All the CPUs support dual-channel DDR4 RAM at up to 2400 MT/s speed. Models i5 and up support it at up to 2666 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.

Processor
branding Model Cores
(Threads) Clock rate (GHz) Integrated GPU Smart
Cache TDP Release
date MSRP Base Turbo Model Clock (MHz) Core i7 8086K 6 (12) 4.0 5.0 UHD 630 350–1200 12 MB 95 W June 2018 US $425 8700K 3.7 4.7 October 2017 US $359 8700 3.2 4.6 65 W US $303 8700T 2.4 4.0 35 W April 2018 Core i5 8600K 6 (6) 3.6 4.3 350–1150 9 MB 95 W October 2017 US $257 8600 3.1 65 W April 2018 US $213 8600T 2.3 3.7 35 W 8500 3.0 4.1 350–1100 65 W US $192 8500T 2.1 3.5 35 W 8400 2.8 4.0 350–1050 65 W October 2017 US $182 8400T 1.7 3.3 35 W April 2018 Core i3 8350K 4 (4) 4.0 — 350–1150 8 MB 91 W October 2017 US $168 8300 3.7 62 W April 2018 US $138 8300T 3.2 350–1100 35 W 8100 3.6 6 MB 65 W October 2017 US $117 8100F — January 2019 8100T 3.1 UHD 630 350–1100 35 W April 2018

Common features:

Socket: LGA 1151-2.
All the CPUs support dual-channel DDR4 RAM at up to 2400 MT/s speed. Models i5 and up support it at up to 2666 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.
i9-9900KS has all-core boost clock of 5.0 GHz.

Processor
branding Model Cores
(Threads) Clock rate (GHz) Integrated GPU Smart
Cache TDP Release
date MSRP Base Turbo Model Clock (MHz) Core i9 9900KS 8 (16) 4.0 5.0 UHD 630 350–1200 16 MB 127 W October 2019 US $524 9900K 3.6 95 W October 2018 US $488 9900KF — January 2019 US $463 9900 3.1 UHD 630 350–1200 65 W April 2019 US $439 9900T 2.1 4.4 35 W Core i7 9700K 8 (8) 3.6 4.9 12 MB 95 W October 2018 US $374 9700KF — January 2019 9700 3.0 4.7 UHD 630 350–1200 65 W April 2019 US $323 9700F — 9700T 2.0 4.3 UHD 630 350–1200 35 W Core i5 9600K 6 (6) 3.7 4.6 350–1150 9 MB 95 W October 2018 US $262 9600KF — January 2019 US $263 9600 3.1 UHD 630 350–1150 65 W April 2019 US $213 9600T 2.3 3.9 35 W 9500 3.0 4.2 350–1100 65 W US $192 9500F — 9500T 2.2 3.7 UHD 630 350–1100 35 W 9400 2.9 4.1 350–1050 65 W January 2019 US $182 9400F — 9400T 1.8 3.4 UHD 630 350–1050 35 W April 2019 Core i3 9350K 4 (4) 4.0 4.6 350–1150 8 MB 91 W US $173 9350KF — January 2019 9320 3.7 4.4 UHD 630 350–1150 62 W April 2019 US $154 9300 4.3 US $143 9300T 3.2 3.8 350–1100 35 W 9100 3.6 4.2 6 MB 65 W US $122 9100F — 9100T 3.1 3.7 UHD 630 350–1100 35 W

Common features:

Socket: LGA 2066.
All the CPUs support quad-channel DDR4-2666 RAM.
All CPU models provide 44 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.

Processor
branding Model Cores
(Threads) Clock rate (GHz) Smart
Cache TDP Release
date MSRP Base Turbo
2.0 Turbo
3.0 Core i9 9990XE^[19] 14 (28) 4.0 5.0 5.0 19.25 MB 255 W January 2019 OEM 9980XE 18 (36) 3.0 4.4 4.5 24.75 MB 165 W Q4 2018 US $1979 9960X 16 (32) 3.1 22 MB US $1684 9940X 14 (28) 3.3 19.25 MB US $1387 9920X 12 (24) 3.5 US $1189 9900X 10 (20) US $989 9820X 3.3 4.1 4.2 16.5 MB US $889 Core i7 9800X 8 (16) 3.8 4.4 4.5 November 2018 US $589

Common features:

Socket: LGA 1200.
All the CPUs support dual-channel DDR4 RAM at up to 2666 MT/s speed. Models i7 and up support it at up to 2933 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.
i9 and i7 models support Turbo Boost 3.0, while i5 and i3 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Processor
branding Model Cores
(Threads) Clock rate (GHz) Integrated GPU Smart
Cache TDP Release
date MSRP Base Turbo TVB Model Clock (MHz) Core i9 10900K 10 (20) 3.7 5.2 5.3 UHD 630 350–1200 20 MB 125 W April 2020 US $488 10900KF — US $472 10910 3.6 5.0 — UHD 630 350–1200 Q3 2020 OEM 10900 2.8 5.1 5.2 65 W April 2020 US $439 10900F — US $422 10900T 1.9 4.6 — UHD 630 350–1200 35 W US $439 10850K 3.6 5.1 5.2 125 W July 2020 US $453 Core i7 10700K 8 (16) 3.8 5.1 — 16 MB May 2020 US $374 10700KF — US $349 10700 2.9 4.8 UHD 630 350–1200 65 W US $323 10700F — US $298 10700T 2.0 4.5 UHD 630 350–1200 35 W US $325 Core i5 10600K 6 (12) 4.1 4.8 12 MB 125 W April 2020 US $262 10600KF — US $237 10600 3.3 UHD 630 350–1200 65 W US $213 10600T 2.4 4.0 35 W 10500 3.1 4.5 350–1150 65 W US $192 10500T 2.3 3.8 35 W 10400 2.9 4.3 350–1100 65 W US $182 10400F — US $157 10400T 2.0 3.6 UHD 630 350–1100 35 W US $182 Core i3 10320 4 (8) 3.8 4.6 350–1150 8 MB 65 W US $154 10300 3.7 4.4 US $143 10300T 3.0 3.9 350–1100 35 W 10100 3.6 4.3 6 MB 65 W US $122 10100F — October 2020 US $97 10100T 3.0 3.8 UHD 630 350–1100 35 W April 2020 US $122 Comet Lake-S (refresh)[edit]

Released on the same day as the 11th gen Rocket Lake-S desktop processors.

Common features:

Socket: LGA 1200.
All the CPUs support dual-channel DDR4-2666 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
All models support Turbo Boost 2.0.

Cascade Lake-X (10xxx)[edit]

Common features:

Socket: LGA 2066.
All the CPUs support quad-channel DDR4-2933 RAM.
All CPU models provide 48 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.

Common features:

Socket: LGA 1200.
All the CPUs support dual-channel DDR4-3200 RAM. The Core i9 K/KF processors enable a 1:1 ratio of DRAM to memory controller by default at DDR4-3200, whereas the Core i9 non K/KF and all other CPUs listed below enable a 2:1 ratio of DRAM to memory controller by default at DDR4-3200 and a 1:1 ratio by default at DDR4-2933.^[20]
All CPU models provide 20 lanes of PCIe 4.0.
All CPUs feature a DMI 3.0 8-lane bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 512 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.
i9 and i7 models support Turbo Boost 3.0, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Common features:

Socket: BGA 1787 (soldered).
All the CPUs support dual-channel DDR4-3200 RAM.
All CPU models provide 20 lanes of PCIe 4.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 1.25 MB per core.
Fabrication process: 10 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.
These CPUs were sold to OEMs only.

Common features:

Socket: LGA 1700.
All the CPUs support dual-channel DDR4-3200 or DDR5-4800 RAM.
All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 1.25 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores)
Fabrication process: Intel 7.
K-suffix processors have an unlocked multiplier and can be overclocked.
i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Processor
branding Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache TDP Release
date MSRP Cores
(Threads) Clock rate (GHz) Cores
(Threads) Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo Base Turbo TVB Base Turbo Core i9 12900KS 8 (16) 3.4 5.3 5.5 8 (8) 2.5 4.0 UHD 770 300–1550 30 MB 150 W 241 W April 2022 US $739 12900K 3.2 5.2 — 2.4 3.9 125 W November 2021 US $589 12900KF — US $564 12900 2.4 5.1 1.8 3.8 UHD 770 300–1550 65 W 202 W January 2022 US $489 12900F — US $464 12900T 1.4 4.9 1.0 3.6 UHD 770 300–1550 35 W 106 W US $489 Core i7 12700K 3.6 5.0 4 (4) 2.7 3.8 300–1500 25 MB 125 W 190 W November 2021 US $409 12700KF — US $384 12700 2.1 4.9 1.6 3.6 UHD 770 300–1500 65 W 180 W January 2022 US $339 12700F — US $314 12700T 1.4 4.7 1.0 3.4 UHD 770 300–1500 35 W 106 W US $339 Core i5 12600K 6 (12) 3.7 4.9 2.8 3.6 300–1450 20 MB 125 W 150 W November 2021 US $289 12600KF — US $264 12600 3.3 4.8 — UHD 770 300–1450 18 MB 65 W 117 W January 2022 US $223 12600T 2.1 4.6 35 W 74 W 12500 3.0 65 W 117 W US $202 12500T 2.0 4.4 35 W 74 W 12490F^[21] 3.0 4.6 — 20 MB 65 W 117 W February 2022 CN ¥1599 12400 2.5 4.4 UHD 730 300–1450 18 MB January 2022 US $202 12400F — US $192 12400T 1.8 4.2 UHD 730 350–1450 35 W 74 W US $202 Core i3 12300 4 (8) 3.5 4.4 12 MB 60 W 89 W US $143 12300T 2.3 4.2 35 W 69 W 12100 3.3 4.3 300–1400 60 W 89 W US $122 12100F — 58 W US $97 12100T 2.2 4.1 UHD 730 300–1400 35 W 69 W US $122

Common features:

Socket: LGA 1700.
All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM.
All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core on i5-13600K/KF and above models, 1.25 MB per core on 13600 and below models.
- E-cores: 4 MB per E-core cluster on i5-13600K/KF and above models, 2 MB per cluster on 13600 and below models (each "cluster" contains four cores).
Fabrication process: Intel 7.
K-suffix processors have an unlocked multiplier and can be overclocked.
i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Processor
branding Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache TDP Release
date MSRP Cores
(Threads) Clock rate (GHz) Cores
(Threads) Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo Base Turbo TVB Base Turbo Core i9 13900KS 8 (16) 3.2 5.8 6.0 16 (16) 2.4 4.3 UHD 770 300–1650 36 MB 150 W 253 W January 2023 US $689 13900K 3.0 5.7 5.8 2.2 125 W October 2022 US $589 13900KF — US $564 13900 2.0 5.5 5.6 1.5 4.2 UHD 770 300–1650 65 W 219 W January 2023 US $549 13900F — US $524 13900T 1.1 5.3 — 0.8 3.9 UHD 770 300–1650 35 W 106 W US $549 Core i7 13790F 2.1 5.2 8 (8) 1.5 4.1 — 33 MB 65 W 219 W February 2023 CN ¥2999 13700K 3.4 5.4 2.5 4.2 UHD 770 300–1600 30 MB 125 W 253 W October 2022 US $409 13700KF — US $384 13700 2.1 5.2 1.5 4.1 UHD 770 300–1600 65 W 219 W January 2023 13700F — US $359 13700T 1.4 4.9 1.0 3.6 UHD 770 300–1600 35 W 106 W US $384 Core i5 13600K 6 (12) 3.5 5.1 2.6 3.9 300–1500 24 MB 125 W 181 W October 2022 US $319 13600KF — US $294 13600 2.7 5.0 2.0 3.7 UHD 770 300–1550 65 W 154 W January 2023 US $255 13600T 1.8 4.8 1.3 3.4 35 W 92 W 13500 2.5 1.8 3.5 65 W 154 W US $232 13500T 1.6 4.6 1.2 3.2 35 W 92 W 13490F 2.5 4.8 4 (4) 1.8 3.5 — 65 W 148 W February 2023 CN ¥1599 13400 4.6 3.3 UHD 730 300–1550 20 MB 65 W 154 W January 2023 US $221 13400F — 148 W US $196 13400T 1.3 4.4 1.0 3.0 UHD 730 300–1550 35 W 82 W US $221 Core i3 13100 4 (8) 3.4 4.5 — 300–1500 12 MB 60 W 89 W US $134 13100F — US $109 13100T 2.5 4.2 UHD 730 300–1500 35 W 69 W US $134 Raptor Lake-S Refresh[edit]

Common features:

Socket: LGA 1700.
All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM.
All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core on i5-14600/T/K/KF and above models, 1.25 MB per core on 14500 and below models.
- E-cores: 4 MB per E-core cluster on i5-14600/T/K/KF and above models, 2 MB per cluster on 14500 and below models (each "cluster" contains four cores).
Fabrication process: Intel 7.
K-suffix processors have an unlocked multiplier and can be overclocked.
i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Processor
branding Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache TDP Release
date MSRP Cores
(Threads) Clock rate (GHz) Cores
(Threads) Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo Base Turbo TVB Base Turbo Core i9 14900KS 8 (16) 3.2 5.9 6.2 16 (16) 2.4 4.5 UHD 770 300–1650 36 MB 150 W 253 W March 2024 US $689 14900K 5.8 6.0 4.4 125 W October 2023 US $589 14900KF — US $564 14900 2.0 5.6 5.8 1.5 4.3 UHD 770 300–1650 65 W 219 W January 2024 US $549 14900F — US $524 14900T 1.1 5.5 — 0.9 3.7 UHD 770 300–1650 35 W 106 W US $549 Core i7 14790F 2.1 5.4 8 (8) 1.5 4.2 — 65 W 219 W China only 14700K 3.4 5.6 12 (12) 2.5 4.3 UHD 770 300–1600 33 MB 125 W 253 W October 2023 US $409 14700KF — US $384 14700 2.1 5.4 1.5 4.2 UHD 770 300–1600 65 W 219 W January 2024 14700F — US $359 14700T 1.3 5.2 0.9 3.7 UHD 770 300–1600 35 W 106 W US $384 Core i5 14600K 6 (12) 3.5 5.3 8 (8) 2.6 4.0 300–1550 24 MB 125 W 181 W October 2023 US $319 14600KF — US $294 14600 2.7 5.2 2.0 3.9 UHD 770 300–1550 65 W 154 W January 2024 US $255 14600T 1.8 5.1 1.3 3.6 35 W 92 W 14500 2.6 5.0 1.9 3.7 65 W 154 W US $232 14500T 1.7 4.8 1.2 3.4 35 W 92 W 14490F 2.8 4.9 4 (4) 2.1 3.7 — 65 W 148 W China only 14400 2.5 4.7 1.8 3.5 UHD 730 300–1550 20 MB US $221 14400F — US $196 14400T 1.5 4.5 1.1 3.2 UHD 730 300–1550 35 W 82 W US $221 Core i3 14100 4 (8) 3.5 4.7 — 300–1500 12 MB 60 W 110 W US $134 14100F — US $109 14100T 2.7 4.4 UHD 730 300–500 35 W 69 W US $134 Core Ultra (Series 2)[edit]

Common features:

Socket: LGA 1851.
All the CPUs support up to dual-channel DDR5-5600 (UDIMM) or DDR5-6400 (CUDIMM) RAM.^[22]
All the CPUs provide 20 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 112 KB (48 KB (12-Way) data + 64 KB (16-Way) instructions) per core.
- E-cores: 96 KB (32 KB (8-Way) data + 64 KB (16-Way) instructions) per core.
L2 cache:
- P-cores: 3 MB (12-Way) per core.
- E-cores: 4 MB (16-Way) per E-core cluster (each "cluster" contains four cores).
Fabrication process: Compute Tile (Contains the CPU cores) TSMC's N3B node.
K-suffix processors have an unlocked multiplier and can be overclocked.
Core Ultra 9 and Core Ultra 7 models support Turbo Boost 3.0 on the P-cores, while Core Ultra 5 models only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Processor
branding Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache NPU
(TOPS) TDP Release
date MSRP Cores
(Threads) Clock rate (GHz) Cores
(Threads) Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo Base Turbo TVB Base Turbo Core Ultra 9 285K 8 (8) 3.7 5.6 5.7 16 (16) 3.2 4.6 Intel Graphics
(4 Xe-cores) 300–2000 36 MB 13 125 W 250 W October 2024 US $589 285 2.5 5.5 5.6 1.9 65 W 182 W January 2025 US $549 285T 1.4 5.4 — 1.2 35 W 112 W Core Ultra 7 265K 3.9 5.5 12 (12) 3.3 30 MB 125 W 250 W October 2024 US $394 265KF — US $379 265 2.4 5.3 1.8 Intel Graphics
(4 Xe-cores) 300-1950 65 W 182 W January 2025 US $384 265F — US $369 265T 1.5 1.2 Intel Graphics
(4 Xe-cores) 300-1950 35 W 112 W US $384 Core Ultra 5 245K 6 (6) 4.2 5.2 8 (8) 3.6 300–1900 24 MB 125 W 159 W October 2024 US $309 245KF — US $294 245 3.5 5.1 3.0 4.5 Intel Graphics
(4 Xe-cores) 300–1900 65 W 121 W January 2025 US $270 245T 2.2 1.7 35 W 114 W 235 3.4 5.0 2.9 4.4 Intel Graphics
(3 Xe-cores) 300–2000 65 W 121 W US $247 235T 2.2 1.6 35 W 114 W 225 3.3 4.9 4 (4) 2.7 Intel Graphics
(2 Xe-cores) 300–1800 20 MB 65 W 121 W US $236 225F — US $221 225T 2.5 1.9 Intel Graphics
(2 Xe-cores) 300–1800 35 W 114 W ? Inside of old Sony VAIO laptop (VGN-C140G)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
Die size: 81 mm²
Steppings: A1

"Merom", "Merom-2M" (standard-voltage, 65 nm) [edit]

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
Model T7600G features an unlocked clock multiplier. Only sold OEM in the Dell XPS M1710.
Intel VT-x: Supported by T5500 (L2), T5600 and all T7xxx
Intel Dynamic Front Side Bus Frequency Switching: Supported by E1, G0, G2, M0 Steppings
Socket P processors can throttle the front-side bus (FSB) anywhere between 400 and 800 MT/s as needed.
Die size: 143 mm² (Merom), 111 mm² (Merom-2M)
Steppings: B2, E1, G0, G2 (Merom), L2, M0 (Merom-2M)
All models of stepping B2 released in July 2006, stepping L2 released in January 2007.

See also: Versions of the same Merom-2M core with half the L2 cache disabled are available under the Pentium Dual-Core brand.

"Merom" (low-voltage, 65 nm)[edit]

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
Intel Dynamic Front Side Bus Frequency Switching: Supported by E1, G0, G2 Steppings
Die size: 143 mm²
Steppings: B2, E1, G0, G2

"Merom-2M" (ultra-low-voltage, 65 nm)[edit]

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
Die size: 111 mm²
Steppings: L2, M0

"Merom XE" (65 nm) [edit]

These models feature an unlocked clock multiplier

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Front Side Bus Frequency Switching
Merom XE processors support Dynamic Front Side Bus Throttling between 400 and 800 MT/s.
Die size: 143 mm²
Steppings: E1, G0

"Penryn-L" (45 nm) [edit]

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
Socket P processors can throttle the front-side bus (FSB) anywhere between 400 and 800 MT/s as needed.
Die size: 82 mm²
228 million transistors
Package size: 22 mm × 22 mm
Steppings: M0, R0

"Penryn" (Apple iMac specific, 45 nm)[edit]

Die size: 107 mm²
The 2008 20" iMac used the E8135 and E8335 CPUs at a lower than specified clock frequency, explaining why the same model is used at different frequencies. This list shows the frequencies used by Apple.
Steppings: C0, E0

"Penryn", "Penryn-3M" (standard-voltage, 45 nm) [edit]

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel Dynamic Acceleration (IDA)^[29]
T6570,^[30] T6670, all T8xxx and T9xxx models support Intel VT-x
All T9xxx models support Trusted Execution Technology (TXT)
T6xxx models are Penryn-3M processors with 1 MB L2 cache disabled.

Note that models T8100, T8300, T9300, T9500 are Penryn processors designed for Santa Rosa Refresh platforms with maximum FSB of 800 MT/s, whereas the rest of the Penryn processors are designed for Montevina platforms that can go up to maximum FSB of 1066 MT/s.

Penryn processors support Dynamic Front Side Bus Throttling between 400–800MT/s.

Die size: 107 mm² (Penryn), 82 mm² (Penryn-3M)
Steppings: C0, E0 (Penryn) M0, R0 (Penryn-3M)^[29]

"Penryn", "Penryn-3M" (medium-voltage, 45 nm) [edit]

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x (except the non-Mac P7350, P7450),^[31]^[32]^[33] Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
Select Apple subsets of P7000 series processors support Intel VT-x.^[34]
Penryn and Penryn-3M processors support Dynamic Front Side Bus Throttling between 533–1066MT/s.
Die size: 107 mm² (Penryn), 82 mm² (Penryn-3M)
Package size: 35 mm × 35 mm
Transistors: 410 million ^[35]
Steppings: (Core microarchitecture 45nm steppings)
- C0, E0 (Penryn)
- M0, R0 (Penryn-3M)
- stepping C0/M0 is only used in the Intel Mobile 965 Express (Santa Rosa refresh) platform
- stepping E0/R0 adds two new instructions (XSAVE/XRSTOR) and supports the later Intel Mobile 4 Express (Montevina) platform

"Penryn" (medium-voltage, 45 nm, Small Form Factor)[edit]

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
Die size: 107 mm²
Package size: 22 mm × 22 mm
Steppings: C0, E0

"Penryn" (low-voltage, 45 nm, Small Form Factor)[edit]

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
Die size: 107 mm²
Package size: 22 mm × 22 mm
Steppings: C0, E0

"Penryn-3M" (ultra-low-voltage, 45 nm, Small Form Factor)[edit]

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT) (except SU7300), Intel Dynamic Acceleration (IDA)
Die size: 107 mm²
Package size: 22 mm × 22 mm
Steppings: M0, R0

"Penryn XE" (45 nm) [edit]

These models feature an unlocked clock multiplier
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
Penryn XE processors support Dynamic Front Side Bus Throttling between 400–800 MT/s and 533–1066 MT/s.
Die size: 107 mm²
Steppings: C0, E0

"Penryn QC" (45 nm) [edit]

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
Can throttle the front-side bus (FSB) anywhere between 533 and 1066 MT/s as needed.
Die size: 2 × 107 mm²
Steppings: E0

"Penryn QC XE" (45 nm) [edit]

This model features an unlocked clock multiplier usually manipulated through the systems BIOS however some manufacturers (such as HP) do not have this feature enabled on their laptops that use this processor.
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
Can throttle the front-side bus (FSB) anywhere between 533 and 1066 MT/s as needed.
Package size: 35 mm × 35 mm
Die size: 2 × 107 mm²
Steppings: E0

Common features:

Socket: G1.
All the CPUs support dual-channel DDR3-1333 RAM.
All CPU models provide 16 lanes of PCIe 2.0.
All CPUs feature a DMI 1.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 45 nm.
XM-suffix processors have an unlocked multiplier and can be overclocked.

Common features:

Socket: All models (except i3-380M) are available in BGA-1288; M-suffix (excluding UM- and LM-suffix) models are also available as Socket G1.
All the CPUs support dual-channel DDR3 RAM. All models support it at 800 MT/s speeds while M- and LM-suffix models support up to 1066 MT/s speeds.
All CPU models provide 16 lanes of PCIe 2.0.
All CPUs feature a DMI 1.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 32 nm.

Processor
branding Model Cores
(Threads) Clock rate (GHz) Integrated GPU Smart
Cache TDP Release
date Base Turbo Model Clock (MHz) Core i7 680UM 2 (4) 1.46 2.53 HD Graphics 166–500 4 MB 18 W September 2010 660LM 2.26 3.06 266–566 25 W 660UM 1.33 2.40 166–500 18 W May 2010 640M 2.80 3.46 500–766 35 W September 2010 640LM 2.13 2.93 266–566 25 W January 2010 640UM 1.20 2.27 166–500 18 W 620M 2.66 3.33 500–766 35 W 620LM 2.00 2.80 266–566 25 W 620UM 1.06 2.13 166–500 18 W Core i5 580M 2.66 3.33 500–766 3 MB 35 W September 2010 560M 3.20 560UM 1.33 2.13 166–500 18 W 540M 2.53 3.07 500–766 35 W January 2010 540UM 1.20 2.00 166–500 18 W May 2010 520M 2.40 2.93 500–766 35 W January 2010 520UM 1.07 1.87 166–500 18 W 480M 2.66 2.93 500–766 35 W January 2011 470UM 1.33 1.86 166–500 18 W October 2010 460M 2.53 2.80 500–766 35 W September 2010 450M 2.40 2.66 June 2010 430M 2.26 2.53 January 2010 430UM 1.20 1.73 166–500 18 W May 2010 Core i3 390M 2.66 — 500–667 35 W January 2011 380M 2.53 September 2010 380UM 1.33 166–500 18 W October 2010 370M 2.40 500–667 35 W June 2010 350M 2.26 January 2010 330M 2.13 330UM 1.20 166–500 18 W May 2010

Common features:

Socket: G2, BGA 1023 (dual-core models), BGA 1224 (quad-core models).
All the CPUs support dual-channel DDR3 RAM. All models support it at 1333 MT/s speeds while i7-2720QM and above support up to 1600 MT/s speeds.
All CPU models provide 16 lanes of PCIe 2.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 32 nm.
XM-suffix models have an unlocked multiplier and can be overclocked.

Processor
branding Model Cores
(Threads) Clock rate (GHz) Integrated GPU Smart
Cache TDP Release
date Base Turbo Model Clock (MHz) Core i7 2960XM 4 (8) 2.7 3.7 HD 3000 650–1300 8 MB 55 W September 2011 2920XM 2.5 3.5 January 2011 2860QM 3.6 45 W September 2011 2820QM 2.3 3.4 January 2011 2760QM 2.4 3.5 6 MB September 2011 2720QM 2.2 3.3 January 2011 2675QM 3.1 650–1200 October 2011 2670QM 650–1100 2635QM 2.0 2.9 650–1200 January 2011 2630QM 650–1100 2677M 2 (4) 1.8 2.9 350–1200 4 MB 17 W June 2011 2657M 1.6 2.7 350–1000 February 2011 2640M 2.8 3.5 650–1300 35 W September 2011 2649M 2.3 3.2 500–1100 25 W February 2011 2637M 1.7 2.8 350–1200 17 W June 2011 2620M 2.7 3.4 650–1300 35 W February 2011 2629M 2.1 3.0 500–1100 25 W 2617M 1.5 2.6 350–950 17 W Core i5 2557M 1.7 2.7 350–1200 3 MB June 2011 2540M 2.6 3.3 650–1300 35 W February 2011 2537M 1.4 2.3 350–900 17 W 2520M 2.5 3.2 650–1300 35 W 2467M 1.6 2.3 350–1150 17 W June 2011 2450M 2.5 3.1 650–1300 35 W January 2012 2435M 2.4 3.0 September 2011 2430M 650–1200 October 2011 2415M 2.3 2.9 650–1300 Q1 2011 2410M 650–1200 February 2011 Core i3 2370M 2.4 — 650–1150 January 2012 2377M 1.5 350–1000 17 W September 2012 2375M Q1 2013 2367M 1.4 October 2011 2365M September 2012 2350M 2.3 650–1150 35 W October 2011 2357M 1.3 350–950 17 W June 2011 2348M 2.3 650–1150 35 W January 2013 2332M^[38] 2.2 650–1100 September 2011 2330M June 2011 2328M September 2012 2312M 2.1 Q2 2011 2310M February 2011 2308M^[39] Q3 2012 Intel i5 3230M die shot

Common features:

Socket: G2, BGA 1023 (dual-core models), BGA 1224 (quad-core models).
All the CPUs support dual-channel DDR3 or DDR3L RAM, at up to 1600 MT/s speed.
All CPU models provide 16 lanes of PCIe, except Y-suffix models which do not have PCIe support. i5 and i7 M-, QM- and XM-suffix models support it at PCIe 3.0 speeds, while all other models support it at PCIe 2.0 speeds.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 22 nm.
XM-suffix models have an unlocked multiplier and can be overclocked.

Processor
branding Model Cores
(Threads) Clock rate (GHz) Integrated GPU Smart
Cache TDP Release
date Base Turbo Model Clock (MHz) Core i7 3940XM 4 (8) 3.0 3.9 HD 4000 650–1350 8 MB 55 W September 2012 3920XM 2.9 3.8 650–1300 April 2012 3840QM 2.8 45 W September 2012 3820QM 2.7 3.7 650–1250 April 2012 3740QM 650–1300 6 MB September 2012 3720QM 2.6 3.6 650–1250 April 2012 3635QM 2.4 3.4 650–1200 September 2012 3630QM 650–1150 3632QM 2.2 3.2 35 W October 2012 3615QM 2.3 3.3 650–1200 45 W April 2012 3610QM 650–1100 3612QM 2.1 3.1 35 W 3687U 2 (4) 2.1 3.3 350–1200 4 MB 17 W January 2013 3689Y 1.5 2.6 350–850 13 W 3667U 2.0 3.2 350–1150 17 W June 2012 3540M 3.0 3.7 650–1300 35 W January 2013 3537U 2.0 3.1 350–1200 17 W 3520M 2.9 3.6 650–1250 35 W June 2012 3517U 1.9 3.0 350–1150 17 W Core i5 3437U 2.9 650–1200 3 MB January 2013 3439Y 1.5 2.3 350–850 13 W 3427U 1.8 2.8 350–1150 17 W June 2012 3380M 2.9 3.6 650–1250 35 W January 2013 3360M 2.8 3.5 650–1200 June 2012 3340M 2.7 3.4 650–1250 January 2013 3337U 1.8 2.7 350–1100 17 W 3339Y 1.5 2.0 350–850 13 W 3320M 2.6 3.3 650–1200 35 W June 2012 3317U 1.7 2.6 350–1050 17 W 3230M 2.6 3.2 650–1100 35 W January 2013 3210M 2.5 3.1 June 2012 Core i3 3227U 1.9 — 350–1100 17 W January 2013 3229Y 1.4 350–850 13 W 3217U 1.8 350–1050 17 W June 2012 3130M 2.6 650–1100 35 W January 2013 3120M 2.5 September 2012 3110M 2.4 650–1000 June 2012

Common features:

Socket: G3.
All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
All CPU models provide 16 lanes of PCIe. i5 and i7 models support it at PCIe 3.0 speeds, while i3 models support it at PCIe 2.0 speeds.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 22 nm.
MX-suffix models have an unlocked multiplier and can be overclocked.

Common features:

Socket: BGA 1168.
All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed.
All CPU models provide 12 lanes of PCIe 2.0 except i3-4xx5U models, which provide 10 lanes of PCIe 2.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 22 nm.

Processor
branding Model Cores
(Threads) Clock rate (GHz) Integrated GPU Smart
Cache TDP Release
date Base Turbo Model Clock (MHz) Core i7 4650U 2 (4) 1.7 3.3 HD 5000 200–1100 4 MB 15 W June 2013 4600U 2.1 HD 4400 September 2013 4578U 3.0 3.5 Iris 5100 200–1200 28 W July 2014 4558U 2.8 3.3 June 2013 4550U 1.5 3.0 HD 5000 200–1100 15 W 4510U 2.0 3.1 HD 4400 April 2014 4500U 1.8 3.0 June 2013 Core i5 4360U 1.5 HD 5000 3 MB February 2014 4350U 1.4 2.9 June 2013 4310U 2.0 3.0 HD 4400 February 2014 4308U 2.8 3.3 Iris 5100 200–1200 28 W July 2014 4300U 1.9 2.9 HD 4400 200–1100 15 W September 2013 4288U 2.6 3.1 Iris 5100 200–1200 28 W June 2013 4278U 200–1100 July 2014 4260U 1.4 2.7 HD 5000 200–1000 15 W April 2014 4258U 2.4 2.9 Iris 5100 200–1100 28 W June 2013 4250U 1.3 2.6 HD 5000 200–1000 15 W 4210U 1.7 2.7 HD 4400 April 2014 4200U 1.6 2.6 June 2013 Core i3 4158U 2.0 — Iris 5100 200–1100 28 W 4120U HD 4400 200–1000 15 W April 2014 4100U 1.8 June 2013 4030U 1.9 April 2014 4025U 200–950 4010U 1.7 200–1000 June 2013 4005U 200–950 September 2013

Common features:

Socket: BGA 1168.
All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed.
All CPU models provide 12 lanes of PCIe 2.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 22 nm.

Common features:

Socket: BGA 1364.
All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Models with Iris Pro 5200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
Fabrication process: 22 nm.
i7-4950HQ comes with an unlocked multiplier, allowing for users to overclock it beyond the factory set clock speed.

Common features:

Socket: BGA 1168.
All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed. Models i5-5350U or above, along with all ix-5xx7 models, support LPDDR3 up to 1866 MT/s speed.
All CPU models provide 12 lanes of PCIe 2.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Common features:

Socket: BGA 1364.
All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1866 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Models with Iris Pro 6200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
Fabrication process: 14 nm.

Common features:

Socket: BGA 1234.
All the CPUs support dual-channel DDR3L, DDR3L-RS or LPDDR3 RAM, at up to 1600 MT/s speed.
All CPU models provide 12 lanes of PCIe 2.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Common features:

Socket: BGA 1356.
All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
All CPU models provide 12 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Common features:

Socket: BGA 1440.
All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Models with Iris Pro 580 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Common features:

Socket: BGA 1515.
All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
All CPU models provide 10 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Common features:

Socket: BGA 1356.
All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
All CPU models provide 12 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Common features:

Socket: BGA 1440.
All the CPUs support dual-channel DDR4-2400, DDR3L-1600 or LPDDR3-2133 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Common features:

Socket: BGA 1515.
All the CPUs support dual-channel LPDDR3-1866 or DDR3L-1600 RAM.
All CPU models provide 10 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Core m5 and Core m7 models were rebranded as Core i5 and Core i7.

Common features:

Socket: BGA 1515.
All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
All CPU models provide 10 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Common features:

Socket: BGA 1528.
All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Common features:

Socket: BGA 1440.
All the CPUs support dual-channel DDR4-2666 RAM. Models i5-8300H and above also support LPDDR3-2133 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Common features:

Socket: BGA 1440.
All the CPUs support dual-channel DDR4-2666 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Common features:

Socket: BGA 1356.
All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
All CPU models provide 12 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Common features:

Socket: BGA 2270.
All the CPUs support dual-channel DDR4-2400 RAM.
All CPU models provide 8 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
Kaby Lake-G CPUs have an embedded discrete Radeon RX Vega M GPU as listed in the table below, which have HBM2 VRAM also embedded on the CPU package.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Common features:

Socket: BGA 1515.
All the CPUs support dual-channel LPDDR3-1866 or DDR3L-1600 RAM.
All CPU models provide 10 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Common features:

Socket: BGA 1528.
All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Common features:

Socket: BGA 1528.
All the CPUs support dual-channel DDR4-2400 or LPDDR4(x)-2400 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 10 nm.

Core m5 and Core m7 models were rebranded as Core i5 and Core i7.

Common features:

Socket: BGA 1515.
All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
All CPU models provide 10 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Coffee Lake-H (refresh)[edit]

Common features:

Socket: BGA 1440.
All the CPUs support dual-channel DDR4-2666 or LPDDR3-2133 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Common features:

Socket: BGA 1528.
All the CPUs support dual-channel DDR4-2666, LPDDR4-2933 or LPDDR3-2133 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Common features:

Socket: BGA 1440.
All the CPUs support dual-channel DDR4 RAM, at up to 2933 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Common features:

Socket: BGA 1526, except for models with 'N' in the name which use a smaller BGA 1344 package.
All the CPUs support dual-channel DDR4-3200 or LPDDR4-3733 RAM.
PCIe 3.0 support.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 512 KB per core.
Fabrication process: 10 nm.

Common features:

Socket: BGA 1377, except for models with 'N' in the name which use a smaller BGA 1044 package.
All the CPUs support dual-channel LPDDR4 RAM, at up to 3733 MT/s speed.
PCIe 3.0 support.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 512 KB per core.
Fabrication process: 10 nm.

Amber Lake-Y (10xxx)[edit]

Common features:

Socket: BGA 1377, except for i3-10100Y which uses a smaller BGA package of unknown name.
All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM. Models i3-10110Y and up support LPDDR3 at up to 2133 MT/s speed.
All CPU models provide 10 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Common features:

Socket: BGA 1449.
All the CPUs support dual-channel DDR4-3200 or LPDDR4X-3733 RAM. i5 models and up support LPDDR4X at up to 4266 MT/s speed.
All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 1.25 MB per core.
Fabrication process: 10 nm.
The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.

Common features:

Socket: BGA 1598.
All the CPUs support dual-channel LPDDR4X-4266 RAM.
All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 1.25 MB per core.
Fabrication process: 10 nm.
The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.

Common features:

Socket: BGA 1598.
All the CPUs support dual-channel DDR4-3200 RAM.
All CPU models provide 20 lanes of PCIe 4.0, in addition to 24 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 3.0 8-lane bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 1.25 MB per core.
Fabrication process: 10 nm.
The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Common features:

Socket: BGA 1449.
All the CPUs support dual-channel DDR4-3200 or LPDDR4X-4266 RAM.
PCIe 4.0 support; 12× PCIe lanes provided by on-package PCH are revision 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 1.25 MB per core.
Fabrication process: 10 nm.
The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.

Common features:

Socket: BGA 1781 (ix-12x0U), BGA 1744 (ix-12x5U).
All the CPUs support dual-channel LPDDR5-5200 or LPDDR4X-4266 RAM. ix-12x5U models also support dual-channel DDR5-4800 and DDR4-3200 RAM in addition.
ix-12x0 models provide 4 lanes of PCIe 4.0 and 8 lanes of PCIe 3.0, while ix-12x5U models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 1.25 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.^[42]

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 1.25 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.
The following models are available with IPU (image processing unit): i5-1235U, i3-1215U. Specifications between them and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
All CPU models provide 16 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 1.25 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.
K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Common features:

Socket: BGA 1964.
All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM.
All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 4.0 8-lane bus to the on-package chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 1.25 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.
The i9 models have unlocked multipliers, allowing them to be overclocked.

These are essentially "E-core-only" CPUs, utilizing the Gracemont architecture.

Common features:

Socket: BGA 1264.
All the CPUs support dual-channel DDR5-4800, DDR4-3200 or LPDDR5-4800 RAM.
All CPU models provide 9 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache: 2 MB per cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 1.25 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.
The i3-1315U is available with IPU (image processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (32 KB data + 64 KB instructions) per core.
L2 cache:
- P-cores: (up to) 2 MB per core.
- E-cores: (up to) 4 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.
K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
The i5-13500H is available with IPU (image processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Common features:

Socket: BGA 1792.
All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.

Common features:

Socket: BGA 1964.
All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM. Models i7-13850HX and up support DDR5 at up to 5600 MT/s speed.
All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 4.0 8-lane bus to the on-package chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.
All models support CPU, iGPU, and memory overclocking.^[43]
i9-13980HX features Thermal Velocity Boost. Without it enabled, the maximum boost clock speed is 0.1 GHz lower.

Common features:

Socket: BGA 1964.
All the CPUs support dual-channel DDR5-5600 or DDR4-3200 RAM.
All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.
All models support CPU, iGPU, and memory overclocking.
i7-14650HX, i7-14700HX, and i9-14900HX feature Thermal Velocity Boost. Without it enabled, the maximum boost clock speed is 0.1 GHz lower.
i7-14700HX, and i9-14900HX feature Intel Application Optimization.

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
Includes integrated graphics based on Xe-LP architecture.
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.
The Core 3 100U is available with IPU (image processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Common features:

Socket: BGA 2049.
All the CPUs except 1x4U models support dual-channel DDR5-5600 or LPDDR5X-7466 RAM. 1x4U models support dual-channel LPDDR5(X)-6400.
All CPU models provide 20 lanes of PCIe 4.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
Includes integrated graphics based on Alchemist architecture.
L1 cache:
- P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base (0.4 GHz on 1x4U models), 2.1 GHz boost and have 2 MB of L2 cache.
Fabrication process: Intel 4 (compute tile).
Configurable TDP (cTDP) of 12–28 W is featured on 1x5U models, and 9–15 W on 1x4U models.

Common features:

Socket: BGA 2049.
All the CPUs support dual-channel DDR5-5600 or LPDDR5X-7466 RAM.
All CPU models provide 8 lanes of PCIe 5.0 and 20 lanes of PCIe 4.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
Includes integrated graphics based on Alchemist architecture.
L1 cache:
- P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base (1.0 GHz on Core Ultra 9 185H), 2.5 GHz boost and have 2 MB of L2 cache.
Fabrication process: Intel 4 (compute tile).
Configurable TDP (cTDP) of 35–65 W is featured on Core Ultra 9 185H, and 20–65 W on all other models.

Processor
branding Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache TDP Release
date Cores
(Threads) Clock rate (GHz) Cores
(Threads) Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo Base Turbo Base Turbo Core Ultra 9 185H 6 (12) 2.3 5.1 8 (8) 1.8 3.8 Intel Arc
(8 Xe-cores) ?–2350 24 MB 45 W 115 W December 2023 Core Ultra 7 165H 1.4 5.0 0.9 ?–2300 28 W 155H 4.8 ?–2250 Core Ultra 5 135H 4 (8) 1.7 4.6 1.2 3.6 ?–2200 18 MB 125H 1.2 4.5 0.7 Intel Arc
(7 Xe-cores) Core / Core Ultra 5/7/9 (Series 2)[edit] Raptor Lake-U Refresh[edit] Processor
branding Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache TDP Release
date Cores
(Threads) Clock rate (GHz) Cores
(Threads) Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo Base Turbo Base Turbo Core 7 250U 2 (4) 1.8 5.4 8 (8) 1.2 4.0 Intel Graphics
(96 EU) ?–1300 12 MB 15 W 55 W January 2025 Core 5 220U 1.4 5.0 0.9 3.8 Intel Graphics
(80 EU) Processor
branding Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache TDP Release
date Cores
(Threads) Clock rate (GHz) Cores
(Threads) Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo Base Turbo Base Turbo Core Ultra 7 265U 2 (2) 2.1 5.3 8 (8) 1.7 4.2 Intel Graphics
(4 Xe-cores) ?–2100 12 MB 15 W 57 W January 2025 255U 2.0 5.2 Core Ultra 5 235U 4.9 1.6 4.1 ?–2050 225U 1.5 4.8 1.3 3.8 ?–2000

Common features:

Socket: BGA 2833.
All the CPUs support dual-channel LPDDR5X-8533 RAM (on package).
All CPU models provide 4 lanes of PCIe 5.0.
L1 cache:
- P-cores: 112 KB (48 KB (12-Way) data + 64 KB (16-Way) instructions) per core.
- E-cores: 96 KB (32 KB (8-Way) data + 64 KB (16-Way) instructions) per core.
L2 cache:
- P-cores: 2.5 MB (10-Way) per core.
- E-cores: 4 MB (16-Way) per E-core cluster (each "cluster" contains four cores).
Fabrication process: Compute Tile (Contains the CPU cores) TSMC's N3B node.

Processor
branding Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache NPU Integrated memory TDP Release
date Cores
(Threads) Clock rate (GHz) Cores
(Threads) Clock rate (GHz) Model Clock (MHz) Neural
computes
engines NPU
AI
TOPS Memory
speed Memory
capacity Base Max.
Turbo Base Turbo Base Turbo Core Ultra 9 288V 4 (4) 3.3 5.1 4 (4) 3.3 3.7 Intel Arc 140V
(8 Xe-cores) ?–2050 12 MB 6x
Gen4 48 LPDDR5X
8533 MT/s 32 GB 30 W
(Min:17 W) 37 W September 2024 Core Ultra 7 268V 2.2 5.0 2.2 ?–2000 17 W
(Min:8 W) 266V 16 GB 258V 4.8 ?–1950 47 32 GB 256V 16 GB Core Ultra 5 238V 2.1 4.7 2.1 3.5 Intel Arc 130V
(7 Xe-cores) ?–1850 8 MB 5x
Gen4 40 32 GB 236V 16 GB 228V 4.5 32 GB 226V 16 GB Raptor Lake-H Refresh[edit] Processor
branding Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache TDP Release
date Cores
(Threads) Clock rate (GHz) Cores
(Threads) Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo Base Turbo Base Turbo Core 9 270H 6 (12) 2.7 5.8 8 (8) 2.0 4.1 Iris Xe
(96 EU) ?–1550 24 MB 45 W 115 W December 2024 Core 7 250H 2.5 5.4 1.8 4.0 240H 5.2 4 (4) UHD Graphics
(64 EU) Core 5 220H 4 (8) 2.7 4.9 8 (8) 2.0 3.7 Iris Xe
(80 EU) ?–1500 18 MB 210H 2.2 4.8 4 (4) 1.6 3.6 UHD Graphics
(48 EU) ?–1400 12 MB Processor
branding Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache NPU
(TOPS) TDP Release
date Cores
(Threads) Clock rate (GHz) Cores
(Threads) Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo Base Turbo Base Turbo Core Ultra 9 285H 6 (6) 2.9 5.4 8 (8) 2.7 4.5 Intel Arc 140T
(8 Xe-cores) ?–2350 24 MB 13 45 W 115 W January 2025 Core Ultra 7 265H 2.2 5.3 1.7 ?–2300 28 W 255H 2.0 5.1 1.5 4.4 ?–2250 Core Ultra 5 235H 4 (4) 2.4 5.0 1.8 18 MB 225H 1.7 4.9 1.3 4.3 Intel Arc 130T
(7 Xe-cores) ?–2200

Common features:

Core Ultra 9 285HX supports Intel vPro and related technologies.

Processor
branding Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache NPU
(TOPS) TDP Release
date Cores
(Threads) Clock rate (GHz) Cores
(Threads) Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo Base Turbo Base Turbo Core Ultra 9 285HX 8 (8) 2.8 5.5 16 (16) 2.1 4.6 Intel Arc
(4 Xe-cores) 300–2000 36 MB 13 55 W 160 W January 2025 275HX 2.7 5.4 300–1900 Core Ultra 7 265HX 2.6 5.3 12(12) 2.3 30 MB 255HX 2.4 5.2 1.8 4.5 300–1850 Core Ultra 5 245HX 6 (6) 3.1 5.1 8 (8) 2.6 Intel Arc
(3 Xe-cores) 300–1900 24 MB 235HX 2.9 Embedded processors[edit]

Common features:

Socket: BGA 1288.
All the CPUs support dual-channel DDR3 RAM. All models support it at 800 MT/s speeds while E- and LE-suffix models support up to 1066 MT/s speeds.
All CPU models provide 16 lanes of PCIe 2.0.
All CPUs feature a DMI 1.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 32 nm.

The following models from the Sandy Bridge desktop range are available as embedded processors:

Core i7-2600
Core i5-2400
Core i3-2120

See section Desktop processors § Sandy Bridge-DT for full info.

Common features:

Socket: G2 (2xx0E and 2xx0QE models except i3-2310E), BGA 1023 (all other models).
All the CPUs support dual-channel DDR3 RAM. All models support it at 1333 MT/s speeds while i7-2720QM and above support up to 1600 MT/s speeds.
All CPU models provide 16 lanes of PCIe 2.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 32 nm.

Common features:

Socket: BGA 1284.
All the CPUs support dual-channel DDR3-1333 RAM.
All CPU models provide 16 lanes of PCIe 2.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 32 nm.

The following models from the Ivy Bridge desktop range are available as embedded processors:

Core i7-3770
Core i5-3550S
Core i3-3220

See section Desktop processors § Ivy Bridge-DT for full info.

Common features:

Socket: G2 (3xx0ME/QE models only), BGA 1023 (all other models and also i5-3610ME, i3-3120ME).
All the CPUs support dual-channel DDR3 and DDR3L RAM, at up to 1600 MT/s speed.
i7 models provide 16 lanes of PCIe 3.0, while i5 models provide 1 lane of PCIe 3.0 and i3 models provide 1 lane of PCIe 2.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 32 nm.

Common features:

Socket: BGA 1284.
All the CPUs support dual-channel DDR3 and DDR3L 1333 MT/s RAM.
All CPU models provide 20 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 22 nm.

Common features:

Socket: LGA 1150.
All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 22 nm.

The following models from the Haswell-DT desktop range are also available as embedded processors:

Core i7-4790S
Core i7-4770S
Core i5-4590S
Core i5-4590T
Core i5-4570S
Core i3-4360
Core i3-4350T
Core i3-4330

See section Desktop processors § Haswell-DT for full info.

Common features:

Socket: BGA 1364.
All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Models with Iris Pro 5200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
Fabrication process: 22 nm.

Common features:

Socket: BGA 1364.
All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Models with Iris Pro 6200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
Fabrication process: 14 nm.

Common features:

Socket: LGA 1151.
All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Common features:

Socket: BGA 1440.
All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Models with Iris Pro 580 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
Fabrication process: 14 nm.

Common features:

Socket: LGA 1151.
All the CPUs support dual-channel DDR4-2400 or DDR3L-1600 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Common features:

Socket: BGA 1440.
All the CPUs support dual-channel DDR4-2400 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Common features:

Socket: BGA 1528.
All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Common features:

Socket: LGA 1151-2.
All the CPUs support dual-channel DDR4-2400 RAM. i5 models and up support it at up to 2666 MT/s speeds.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Coffee Lake-H (refresh)[edit]

Common features:

Socket: BGA 1440.
All the CPUs support dual-channel DDR4-2666 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Common features:

Socket: LGA 1200.
All the CPUs support dual-channel DDR4-2666 RAM. i7 models and higher support it at up to 2933 MT/s speeds.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
i9-10900E features Thermal Velocity Boost.

Common features:

Socket: BGA 1449.
All the CPUs support dual-channel DDR4-3200 or LPDDR4X-3733 RAM. i5 models and up support LPDDR4X at up to 4266 MT/s speed.
All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 1.25 MB per core.
Fabrication process: 10 nm.
All models have configurable TDP (cTDP), which can be set from a minimum of 12 W to 28 W. Base clocks shown are at 15 W TDP; they will be different depending on the cTDP setting chosen.
-GRE suffix models have a minimum operating temperature of -40°C as opposed to 0°C for the normal models, and also feature "in-band ECC" for memory.

Common features:

Socket: BGA 1598.
All the CPUs support dual-channel DDR4-3200 RAM.
All CPU models provide 20 lanes of PCIe 4.0, in addition to 24 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 1.25 MB per core.
Fabrication process: 10 nm.
The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
Minimum operating temperature: 0°C.

Common features:

Socket: LGA 1700.
All the CPUs support dual-channel DDR4-3200 or DDR5-4800 RAM
All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 1.25 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.
Turbo Boost version is 2.0.

Processor
branding Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache TDP Release
date Cores
(Threads) Clock rate (GHz) Cores
(Threads) Clock rate (GHz) Model Clock (MHz) Base Turbo Base Turbo Core i9 12900E 8 (16) 2.3 5.0 8 (8) 1.7 3.8 UHD 770 300–1550 30 MB 65 W January 2022 12900TE 1.1 4.8 1.0 3.6 35 W Core i7 12700E 2.1 4 (4) 1.6 300–1500 25 MB 65 W 12700TE 1.4 4.6 1.0 3.4 35 W Core i5 12500E 6 (12) 2.9 4.5 — 300–1450 18 MB 65 W 12500TE 1.9 4.3 35 W Core i3 12100E 4 (8) 3.2 4.2 UHD 730 300–1400 12 MB 60 W 12100TE 2.1 4.0 35 W

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 1.25 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.

Processor
branding Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache TDP Release
date Cores
(Threads) Clock rate (GHz) Cores
(Threads) Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo Base Turbo Base Turbo Core i7 1265UE 2 (4) ? 4.7 8 (8) ? 3.5 Iris Xe
(96 EU) ?–1250 12 MB 15 W 55 W February 2022 Core i5 1245UE ? 4.4 ? 3.3 Iris Xe
(80 EU) ?–1200 Core i3 1215UE ? 4 (4) ? UHD Graphics
(64 EU) ?–1100 10 MB

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 1.25 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.

Processor
branding Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache TDP Release
date Cores
(Threads) Clock rate (GHz) Cores
(Threads) Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo Base Turbo Base Turbo Core i7 1270PE 4 (8) ? 4.5 8 (8) ? 3.3 Iris Xe
(96 EU) ?–1350 18 MB 28 W 64 W February 2022 Core i5 1250PE ? 4.4 ? 3.2 Iris Xe
(80 EU) ?–1300 12 MB Core i3 1220PE ? 4.2 4 (4) ? 3.1 UHD Graphics
(48 EU) ?–1250 Q1 2022

Common features:

Socket: LGA 1700. While sharing the same socket as Alder Lake-S and Raptor Lake-S, this revision of LGA 1700 is electrically incompatible with other 12th and 13th generation Intel Core desktop processors.
All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM.
All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 1.25 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
All CPU models provide 16 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 1.25 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.

Common features:

Socket: LGA 1700.
All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM.
All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core on i7 and above models, 1.25 MB per core on i5 and below models.
- E-cores: 4 MB per E-core cluster on i7 and above models, 2 MB per cluster on i5 and below models (each "cluster" contains four cores).
Fabrication process: Intel 7.
Turbo Boost version is 2.0.

Processor
branding Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache TDP Release
date Cores
(Threads) Clock rate (GHz) Cores
(Threads) Clock rate (GHz) Model Clock (MHz) Base Turbo Base Turbo Core i9 13900E 8 (16) 1.8 5.2 16 (16) 1.3 4.0 UHD 770 300–1650 36 MB 65 W January 2023 13900TE 1.0 5.0 0.8 3.9 35 W Core i7 13700E 1.9 5.1 8 (8) 1.3 300–1600 30 MB 65 W 13700TE 1.1 4.8 0.8 3.6 35 W Core i5 13500E 6 (12) 2.4 4.6 1.5 3.3 300–1550 24 MB 65 W 13500TE 1.3 4.5 1.1 3.1 35 W 13400E 2.4 4.6 4 (4) 1.5 3.3 20 MB 65 W Core i3 13100E 4 (8) 3.3 4.4 — UHD 730 300–1500 12 MB 60 W 13100TE 2.4 4.1 35 W

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.

Common features:

Socket: LGA 1851 (electrically incompatible with the socket used by non-embedded processors such as Arrow Lake-S).
All the CPUs support dual-channel DDR5-5600 RAM.
All CPU models provide 20 lanes of PCIe 4.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
Includes integrated graphics based on Alchemist architecture.
L1 cache:
- P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base, 2.1 GHz boost (2.5 GHz on HL-suffix models) and have 2 MB of L2 cache.
Fabrication process: Intel 4 (compute tile).
Configurable TDP (cTDP) of 12–28 W is featured on UL-suffix models, and 20–65 W on HL-suffix models.

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ATI provides pointer to Intel's 'Allendale', May 23, 2006
Rumoured prices and specifications for Intel Core 2, May 30, 2006
TGDaily indicates leaked release dates,^{[permanent dead link]} July 24, 2006
Intel to unveil five Merom CPUs in July, paper says(subscription required) as re-reported by DigiTimes, July 17, 2006
Intel Unveils World's Best Processor,^{[dead link]} July 27, 2006
Intel Takes Popular Laptops to 'Extreme' with First-Ever Extreme Edition Mobile Processor; Adds New Desktop Chip,^{[dead link]} July 16, 2007
CORE 2 DUO 1333 MHZ STEPPING Archived May 20, 2022, at the Wayback Machine, July 18, 2007

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